Description :

TAB stands for Tape-Automated Bonding technology. It is the type of technology where the LCD driver is bonded on the PCB by "Tape" or FPC. This type of technology offers several advantages such as compactness- which means IC and circuitry can be hidden behind the LCD glass panel. Also it only requires a small bonding pad compared to wire bonding technology.

Specification :

1. Display format: 112 x 64 dots. 2. LCD driver: S0723TB-01. 3. Model No.: ET112064-10. 4. Size: 52.3 x 36.0 x 1.7. 5. Panel size: 32.5 x 36.0 x 1.7.

Features :

The chip can be attached in a face-up or face-down configuration. On the other hand, the disadvantage of using TAB technology include the time and cost of designing and fabricating the tape and capital expense of the TAB Bonding equipment. Each die must have its own tape and patterned for its bonding configuration. Another is that the bonding area is weak and it is less reliable than COG. For these reasons, we would like to recommend using TAB technology only to high-volume production applications.