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Detail Information

Description :

1. Epoxy Compounds for Civil Engineering Application
Description:
The product has good adhesion and mechaincal strength for a variety of materials, suitable sealing and adhesive.
Product Application:
Sealant, reinforcement, adhesive…… such as adhesion to woods, steel, stone, concrete and metals, or floor coating, and so on.

2.Epoxy Compounds for Adhesives & Sealants Application
Description:
It is good adhesion, toughness and high-temperature resistance.
Product Application:
Superior adhesion to metals, woods, laminated glass, ceramics, and so on.

3. Silicone
Description:
It is silicone moisture curing type with good elasticity and strength, suitable for sealing and adhesion.
Product Application:
Superior adhesion to glass, ceramics, copper, aluminum, stainless steel, electroplating materials, plastic and rubber. For example, electric equipment, sensor, power, LED, LCD, solar cell, coil transition, transformer, communication device, electronic component, and so on.

Specification :

Application	Type	One/ two components	Curing condition	Product name	Features	TDS Download
Application	Type	One/ two components	Curing condition	Product name	Features	Chinese	English
Epoxy compounds for civil engineering application	Sealant	Two	RT curing	AD series	Superior adhesion to woods concrete.	AD series*	AD series*
	Damp-proof	Two	RT curing	PR series	Recommended for floorcoating.	PR series*	PR series*
	Adhesive	Two	RT curing	2102A/B	Fast curing at room temperature, recommended for adhesion to road light reflection mark.	2102A/B	2102A/B
Epoxy compounds for adhesives & sealants application	One component adhesive	One	Heat curing	2062	Superior adhesion to inorganic surface (ex: metals, ceramic……)	2062	2062
	One component adhesive	One	Heat curing	2337	Low viscosity, particularly suitable for metal, ceramics and other inorganic surface. It can be used with the equipment.	2337	2337
	One component adhesive	One	Heat curing	2077-3	Particularly suitable for motor glass fiber wire immersion.	2077-3	2077-3
	One component adhesive	One	Heat curing	AD-2100 series	Particularly suitable for electronic, plastic materials and other surfaces.	AD-2100 series*	AD-2100 series*
	One component adhesive	One	Heat curing	2090	Particularly suitable for nylon materials, good thrust performance at low and high temperature. Products does not overflow by high temperature curing .	2090	2090
	Two component adhesive	Two	RT curing	2500A/B	Superior adhesion to metals, ceramics, plastics……	2500A/B*	2500A/B*
	Forming materials	One	Heat curing	2450	Recommended for grindstone forming.	2450	2450
Silicone	Epoxy Adhesives/ sealants	One	Moistures curing	AD-S100 Series	High viscosity and superior adhesion to glass and plastics.	AD-S100*	AD-S100*