Description :

1. Thermal Grease
Description:
There are variety of specifications available with low thermal impedance, low overflow, none-drying and easy operating.

Product Application:
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.

INTRDUCTION OF THERMAL INTERFACE MATERIALS:
Exquisite, low-weight, thin and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat dissipating efficiency issue may exist in these high-tech products, thereby may cause the undesired issues about increases in manufacture cost and damages in lifetime of products.

2. Thermal Adhesive
Description:
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.

Product Application:
Cooling modules of IC, CPU, MOS, LED, heat sink, relay, notebook PC, PC, and so on.

Specification :

• 
  Epoxy Compounds For Electric Application
• 
  Epoxy Compounds For Coating Application
• 
  Epoxy Compounds For Composite Application
• 
  Epoxy Compounds For Coating & Ink Application
• 
  Epoxy Compounds For Electric Application
• 
  UV Curable Resins For General Adhesive
• 
  Epoxy Resins
• 
  Epoxy Compounds For Composite Application

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