Epolab Chemical Industries Incorporation
Taiwan Manufacturers, Exporters.
Detail Information
Description :
1. Thermal Grease
Description:
There are variety of specifications available with low thermal impedance, low overflow, none-drying and easy operating.
Product Application:
Cooling modules of CPU, MOS, LED, microprocessor, heat sink, graphic card, power relay, and so on.
INTRDUCTION OF THERMAL INTERFACE MATERIALS:
Exquisite, low-weight, thin and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat dissipating efficiency issue may exist in these high-tech products, thereby may cause the undesired issues about increases in manufacture cost and damages in lifetime of products.
2. Thermal Adhesive
Description:
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.
Product Application:
Cooling modules of IC, CPU, MOS, LED, heat sink, relay, notebook PC, PC, and so on.
Specification :
| Application | One/ two components | Curing condition | Product name | Features | TDS Download | |
| Chinese | English | |||||
| Thermal grease | One | N/A | TIM-0001、TIM-1101、TIM-0002、TIM-003
| White. | TIM-0001 TIM-1101 TIM-0002* TIM-0003* | TIM-0001, TIM-1101 TIM-0002* TIM-0003* |
| One | N/A | TIM-2101
| Grey. | TIM-2101 | TIM-2101 | |
| One | N/A | TIM-3101、TIM-3111、TIM-3121、TIM-3202
| Grey and high thermal conductivity. | TIM-3101, TIM-3111*, TIM-3121*, TIM-3202* | TIM-3101, TIM-3111*, TIM-3121*, TIM-3202* | |
| Thermal adhesive | One | Heat curing | 2070-1、2073、 2074
| High thermal conductivity; recommended for adhesion on various electronic parts. | 2070-1, 2073, | 2070-1, 2073, |
| Phase change material | One | N/A | PCM series |
| PCM series* | PCM series* |
Epolab Chemical Industries Incorporation
- Taiwan
- No. 11, Ho-Jiun N. Rd., Chung-Li Industrial Park, Chung-Li, Taoyuan Hsien 320, Taiwan
- 886-3-4521501
- 886-3-4529318