Description :

1. Application: for chips terminal dipping of passive components
2. Carrier: Thin Carrier Plate series, TCP
3. Chips: 0201、0402、0603、0805 and above
4. Capacity: Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.
5. Operational Process:
5-1 Put the TCP on machine by labor.
5-2 Use vacuum approach to put TCP through the chips dipping process
5-3 For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.

Specification :

1. Technical precision:

• Paste thickness precision:±0.01mm
• Action precision: ±0.002mm
• Ink tray plate flatness: ±0.005mm
• The parallelism tolerance between dipping plate and ink tray: ±0.05mm
• Adjustable Ink tray thickness:±0.001mm

2. Machine specification:

• Dimension: 2650 (L)*1200 (W) *2100 mm (H)
• Weight: 1380 Kgs

3. Electric Control:

• Controller: PLC, HMI, Servo Motor…
• Voltage: 3ψ220V(380V), customable
• Electric current: 20(A)
• Power consumption: 4.4(KW)
• Frequency: 50/60Hz
• Air Consumption: 32 (l/min)

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