Description :

*Application: Use the TCP with inserted chips to level or transfer the chips.
*Operational Process
1.Put the TCP with inserted chips on the lower Level Plate by labor.
2.Start the bilateral sensors switch to press the Level Plate down and let the chips protrusion reach height consistency.

Specification :

Machine Specification

1. Dimension: 650 (L)*450 (W)*1350 (H)mm
2. Weight: 150KGS

Electric Control

1. Voltage: 3Ø220VAC
2. Electric current: 1(A)
3. Power consumption: 0.22(KW)
4. Frequency: 50/60Hz
5. Air Consumption: 27 (l/min)

Associated Equipments

1. Top Level Plate * 1 pc
2. Bottom Level Plate * 1pc
3. TCP (with loaded chips) * 1 pc

If you need more detail specification and function in advance, please contact us.

• 
  Air Press From Bottom
• 
  Array Manual Loading Machine
• 
  Array Semi Auto Vibration Loading Machine