Company Introduction :

Manufacturer of electronic materials, such as coverlay(CL), flexible copper cladded laminate (FCCL), coating, chip on film (COF), photo-imaginable-coverlay (PIC), adhesiveless- FCCL (2L-FCCL), chip on glass (COG), tape automatic bonding (TAB) for flexible printed circuit (FPC).

Main Products :

electronic materials- coverlay ( CL ), flexible copper cladded laminate ( FCCL ), coating, chip on film(COF), photo-imaginable-coverlay ( PIC ), adhesiveless- FCCL ( 2L- FCCL ), chip on glass ( COG ), tape automatic bonding
( TAB ) for flexible printed circuit ( FPC ).

Other Information :

Business Nature :	Manufacturer
Year Established :	1997
Company Capital :	USD 0 ~ 1,000,000
Annual Revenue :	USD 0 ~ 1,000,000
President :	Mr. Da Wen Sun
No. of Total Staff :	1 ~ 50
Current Export Markets :	Worldwide
Trade Term :	FOB
Shipment :	Sea
Currency :	USD
Negotiable :	Non-negotiable